$ADI 0.61 Developing

Notable posts

• @StockSavvyShay neutral 1233 eng

  THE SEMICONDUCTOR ECONOMY INSIDE THE IPHONE 17 PRO It's really wild to see how one $AAPL iPhone 17 Pro is essentially a semiconductor economy in your pocket with 12 companies each capturing a different piece of the compute, connectivity, power, sensing and materials stack: 1. $TSM manufactures Apple's A19 Pro processor on its most advanced chipmaking technology turning Apple's chip designs into physical silicon at massive scale. 2. $AVGO supplies RF front end components and wireless charging technology (though Apple's new N1 chip displaced Broadcom as primary Wi-Fi & Bluetooth supplier this generation). 3. $GLW supplies cover glass and Ceramic Shield so essentially the material layer protecting the display and back panel. 4. $QCOM supplies Snapdragon X80 modem in the Pro models which is the last generation before Apple's C2 takes over and reason it stayed is mmWave support that Apple's own C1X lacks. 5. $STM supplies chips used around Face ID, cameras & power management helping Apple control sensors and photographic hardware. 6. $NXPI supplies connectivity controllers including NFC, secure payment hardware and USB Type C control helping iPhone communicate with accessories and contactless systems. 7. $CRUS supplies audio and power chips that help drive the speakers, microphones and other audio functions while efficiently managing power delivery. 8. $TXN supplies analog and power chips used for battery charging, camera flash control and display power so basically managing how electricity moves through parts of the phone. 9. $ADI supplies power conversion and charging chips that regulate voltage and make sure different parts of the phone receive right amount of electricity. 10. $SONY supplies CMOS image sensors, the physical light-capture hardware behind every camera on the phone. 11. $QRVO supplies RF front end modules that filter and amplify cellular signals so the phone can communicate efficiently across different frequency bands. 12. $SWKS supplies additional RF components used to strengthen and manage wireless signals between iPhone and cellular networks.

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• @StockSavvyShay neutral 824 eng

  5 LAYERS OF THE 1.6T OPTICAL SUPPLY CHAIN The move to 1.6T optics is turning every transceiver into a denser semiconductor system with more content flowing into DSPs, lasers, timing, power management and broader network around each module: 1. $MRVL, $AVGO, $CRDO & $ALAB form signal-processing layer behind 1.6T optics supplying DSPs, SerDes, retimers & equalization that push 224G electrical lanes into next-generation transceivers 2. $COHR, $LITE & $AAOI sit at optical front end across lasers, drivers, photodiodes & TIAs with Coherent consuming all of its InP laser output internally, Lumentum demand still running above supply & AAOI already landing a $200M+ volume 1.6T hyperscaler order 3. $SITM is less obvious timing beneficiary supplying precision oscillators inside transceivers on both ends of an optical link so content scales directly with module count as 1.6T deployments ramp 4. $MPWR, $ADI, $TXN, $MCHP & $ON provide power-management layer as higher-speed optics require more voltage regulation, power conversion & thermal control inside every module 5. $APH, $TEL, $GLW, $CIEN, $NOK & $ANET extend the opportunity beyond the transceiver into connectors, fiber & networking infrastructure required to move 1.6T bandwidth across broader AI fabric

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• @StockSavvyShay neutral 793 eng

  THE 5 LAYERS OF AI POWER DELIVERY 1. Facility Power Intake • $CAT supplies backup generation • $GEV supplies grid equipment & gas turbines • $ETN provides switchgear, ATS & electrical distribution • $HUBB supplies grid & power distribution components • $NVT provides enclosures & electrical protection systems • $BE supplies on-site fuel cell power that helps bypass grid constraints 2. AC-to-DC Conversion • $ON supplies silicon carbide power devices • $POWI provides high-voltage AC-to-DC conversion ICs • $TXN provides power supply controllers & conversion ICs 3. Intermediate Bus Conversion • $VICR provides high-density intermediate bus modules 4. Point-of-Load • $AOSL supplies integrated power stages • $MPWR supplies point-of-load power for Nvidia systems • $ADI provides multiphase controllers & power management • $STM supplies SiC, GaN & power-management components for next-generation AI power delivery 5. The 800V DC Transition • $NVTS is working with $NVDA on its 800V HVDC roadmap • $VRT captures the transition through rack power, UPS & cooling infrastructure

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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• @StockSavvyShay bullish 734 eng

  $NVDA VERA RUBIN SUPPLY CHAIN Rubin is becoming a system-level buildout with rising content across memory, packaging, networking, power and cooling pushing the opportunity well beyond the GPU: • Memory sits with $MU, $SKHY & Samsung supplying the DRAM & HBM feeding Rubin accelerators while $SNDK adds exposure to storage layer around AI systems • Advanced packaging runs through $TSM, $AMKR & $INTC for foundry, packaging & assembly while $AMAT, $LRCX, $KLAC, $ASML, $TER & $AEHR provide equipment & testing needed to manufacture complex AI chips • Optical networking spans $COHR, $LITE & $AAOI in optical modules, $AVGO & $MRVL in switching silicon, $CRDO & $ALAB in high-speed connectivity & $GLW, $CIEN, $NOK & $ANET across fiber & network infrastructure • 800VDC power reaches from power semiconductors with $STM, $ON, $NVTS, $POWI & $WOLF into power management with $MPWR, $ADI, $TXN & $VICR • Power infrastructure & cooling sit downstream with $VRT, $ETN & $GEV supplying electrical distribution, backup power & thermal systems needed as rack densities keep rising • Compute systems bring full rack together through $DELL, $HPE & $SMCI which integrate Nvidia compute, networking, memory & power into deployable AI systems

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• @StockSavvyShay bullish 726 eng

  Goldman Sachs just more than tripled its 2035 humanoid TAM to $138B while raising its unit forecast to 6.5M with warehouses and logistics expected to lead adoption. That growth should pull demand through entire robotics stack: • Foundry: $TSM, $GFS • Sensing: $VPG, $NOVT • Vision: $OUST, $AEVA, $INVZ • Memory: $MU, $SKHY, $SNDK • Humanoids: $TSLA, $XPEV, $CCXI • AI Compute: $NVDA, $AMD, $ARM, $QCOM, $INTC • Simulation & Training: $NVDA, $ADSK, $CDNS, $SNPS • Semi Equipment: $ASML, $AMAT, $LRCX, $KLAC, $TER • Power & Control: $NXPI, $STM, $ADI, $TXN, $ON, $MCHP, $MPWR

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• @wallstengine neutral 130 eng

  Analog devices $ADI is asking customers to place orders “at least six months in advance” through preferred channel partners to secure supply.

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• @Beth_Kindig bullish 82 eng

  Analog Devices $ADI CEO Vincent Roche: “And you just look at data center alone, if I just take data center, there's expected to be 100 gigawatts equivalent infrastructure built for data centers between now and kind of 2031.” $NVDA $AMD $AVGO

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