$ETN 0.52 Developing

Notable posts

• @StockSavvyShay neutral 793 eng

  THE 5 LAYERS OF AI POWER DELIVERY 1. Facility Power Intake • $CAT supplies backup generation • $GEV supplies grid equipment & gas turbines • $ETN provides switchgear, ATS & electrical distribution • $HUBB supplies grid & power distribution components • $NVT provides enclosures & electrical protection systems • $BE supplies on-site fuel cell power that helps bypass grid constraints 2. AC-to-DC Conversion • $ON supplies silicon carbide power devices • $POWI provides high-voltage AC-to-DC conversion ICs • $TXN provides power supply controllers & conversion ICs 3. Intermediate Bus Conversion • $VICR provides high-density intermediate bus modules 4. Point-of-Load • $AOSL supplies integrated power stages • $MPWR supplies point-of-load power for Nvidia systems • $ADI provides multiphase controllers & power management • $STM supplies SiC, GaN & power-management components for next-generation AI power delivery 5. The 800V DC Transition • $NVTS is working with $NVDA on its 800V HVDC roadmap • $VRT captures the transition through rack power, UPS & cooling infrastructure

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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• @StockSavvyShay bullish 734 eng

  $NVDA VERA RUBIN SUPPLY CHAIN Rubin is becoming a system-level buildout with rising content across memory, packaging, networking, power and cooling pushing the opportunity well beyond the GPU: • Memory sits with $MU, $SKHY & Samsung supplying the DRAM & HBM feeding Rubin accelerators while $SNDK adds exposure to storage layer around AI systems • Advanced packaging runs through $TSM, $AMKR & $INTC for foundry, packaging & assembly while $AMAT, $LRCX, $KLAC, $ASML, $TER & $AEHR provide equipment & testing needed to manufacture complex AI chips • Optical networking spans $COHR, $LITE & $AAOI in optical modules, $AVGO & $MRVL in switching silicon, $CRDO & $ALAB in high-speed connectivity & $GLW, $CIEN, $NOK & $ANET across fiber & network infrastructure • 800VDC power reaches from power semiconductors with $STM, $ON, $NVTS, $POWI & $WOLF into power management with $MPWR, $ADI, $TXN & $VICR • Power infrastructure & cooling sit downstream with $VRT, $ETN & $GEV supplying electrical distribution, backup power & thermal systems needed as rack densities keep rising • Compute systems bring full rack together through $DELL, $HPE & $SMCI which integrate Nvidia compute, networking, memory & power into deployable AI systems

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• @StockSavvyShay bullish 707 eng

  Morgan Stanley sees data center power demand growing ~9x to nearly 79 GW by 2029. At ~$25M of annual compute revenue per MW, that implies up to $2T of compute revenue and makes entire power stack a picks and shovels opportunity for the AI buildout: • Grid equipment: $GEV, $FPS, $HUBB • Busway & liquid cooling: $VRT, $ETN • Battery storage: $EOSE, $TSLA, $FLNC • Cooling & CDUs: $VRT, $TT, $MOD, $JCI, $NVT • Energized sites: $IREN, $CIFR, $CORZ, $APLD, $WULF

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• @StockSavvyShay bullish 421 eng

  Bernstein shows data center modularization shifting more value toward power and cooling rewarding companies that can industrialize AI buildout while making already energized sites even scarcer: • Grid equipment: $GEV, $FPS, $HUBB • Busway & liquid cooling: $VRT, $ETN • Battery storage: $EOSE, $TSLA, $FLNC • Cooling & CDUs: $VRT, $TT, $MOD, $JCI, $NVT • Energized sites: $IREN, $CIFR, $CORZ, $APLD, $WULF

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• @cevikfinance bullish 142 eng

  Goldman Sachs, hisse senedi piyasasına yönelik olumlu beklentilerini koruyor ve son dönemdeki dalgalanmalara rağmen S&P 500'ün yıl sonuna kadar %8 daha yükselerek 8.000 puana ulaşmasını bekliyor. Yükselişin arkasındaki temel itici güç şirket kârlarındaki artış. Goldman, S&P 500 hisse başına kârının (EPS) 2026'da %24, 2027'de ise %13 büyüyeceğini öngörüyor. Büyük teknoloji şirketlerinin (hyperscalers) sermaye harcamalarının (CapEx) 2026'da, bir önceki yıla göre %84 artarak 750 milyar doların üzerine çıkması bekleniyor. 2027 öngörüsü ise 920 milyar dolar. YZ altyapı şirketlerinin, bu yılki toplam S&P 500 kâr büyümesinin yaklaşık yarısını tek başına sırtlayacağı tahmin ediliyor. Bu YZ altyapı şirketlerine örnek: $GOOGL $AMZN $ORCL $NVDA $AMD $AVGO $DELL $ANET $VRT $ETN $GEV

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• @wallstengine neutral 120 eng

  Trane $TT & Eaton $ETN launched a joint power-&-cooling architecture for next-gen AI data centers, aligned with Nvidia’s DSX AI Factory platform. It can deliver up to 15% better energy efficiency, use 80% less copper & cut installation costs by 30%.

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• @ProfKayaFinance bullish 102 eng

  Modüller, enerji şirketleriyle ilgili araştırma yaparsanız yolun sonunda $ENR | Siemens Enerji çıkıyor. Adamlar öyle gaz türbinleri yapmış ki daha yakalayanını görmedim teknolojik açıdan. Varsa bildiğiniz öğrenmek isterim. Siemens ile $ETN | Eaton bu alanda ortaklıkları var. https://t.co/SqCbFEXwmS

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