$POWI 0.60 Developing

Notable posts

• @StockSavvyShay neutral 793 eng

  THE 5 LAYERS OF AI POWER DELIVERY 1. Facility Power Intake • $CAT supplies backup generation • $GEV supplies grid equipment & gas turbines • $ETN provides switchgear, ATS & electrical distribution • $HUBB supplies grid & power distribution components • $NVT provides enclosures & electrical protection systems • $BE supplies on-site fuel cell power that helps bypass grid constraints 2. AC-to-DC Conversion • $ON supplies silicon carbide power devices • $POWI provides high-voltage AC-to-DC conversion ICs • $TXN provides power supply controllers & conversion ICs 3. Intermediate Bus Conversion • $VICR provides high-density intermediate bus modules 4. Point-of-Load • $AOSL supplies integrated power stages • $MPWR supplies point-of-load power for Nvidia systems • $ADI provides multiphase controllers & power management • $STM supplies SiC, GaN & power-management components for next-generation AI power delivery 5. The 800V DC Transition • $NVTS is working with $NVDA on its 800V HVDC roadmap • $VRT captures the transition through rack power, UPS & cooling infrastructure

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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• @StockSavvyShay bullish 734 eng

  $NVDA VERA RUBIN SUPPLY CHAIN Rubin is becoming a system-level buildout with rising content across memory, packaging, networking, power and cooling pushing the opportunity well beyond the GPU: • Memory sits with $MU, $SKHY & Samsung supplying the DRAM & HBM feeding Rubin accelerators while $SNDK adds exposure to storage layer around AI systems • Advanced packaging runs through $TSM, $AMKR & $INTC for foundry, packaging & assembly while $AMAT, $LRCX, $KLAC, $ASML, $TER & $AEHR provide equipment & testing needed to manufacture complex AI chips • Optical networking spans $COHR, $LITE & $AAOI in optical modules, $AVGO & $MRVL in switching silicon, $CRDO & $ALAB in high-speed connectivity & $GLW, $CIEN, $NOK & $ANET across fiber & network infrastructure • 800VDC power reaches from power semiconductors with $STM, $ON, $NVTS, $POWI & $WOLF into power management with $MPWR, $ADI, $TXN & $VICR • Power infrastructure & cooling sit downstream with $VRT, $ETN & $GEV supplying electrical distribution, backup power & thermal systems needed as rack densities keep rising • Compute systems bring full rack together through $DELL, $HPE & $SMCI which integrate Nvidia compute, networking, memory & power into deployable AI systems

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