$TEL 0.57 Developing

Notable posts

• @StockSavvyShay neutral 824 eng

  5 LAYERS OF THE 1.6T OPTICAL SUPPLY CHAIN The move to 1.6T optics is turning every transceiver into a denser semiconductor system with more content flowing into DSPs, lasers, timing, power management and broader network around each module: 1. $MRVL, $AVGO, $CRDO & $ALAB form signal-processing layer behind 1.6T optics supplying DSPs, SerDes, retimers & equalization that push 224G electrical lanes into next-generation transceivers 2. $COHR, $LITE & $AAOI sit at optical front end across lasers, drivers, photodiodes & TIAs with Coherent consuming all of its InP laser output internally, Lumentum demand still running above supply & AAOI already landing a $200M+ volume 1.6T hyperscaler order 3. $SITM is less obvious timing beneficiary supplying precision oscillators inside transceivers on both ends of an optical link so content scales directly with module count as 1.6T deployments ramp 4. $MPWR, $ADI, $TXN, $MCHP & $ON provide power-management layer as higher-speed optics require more voltage regulation, power conversion & thermal control inside every module 5. $APH, $TEL, $GLW, $CIEN, $NOK & $ANET extend the opportunity beyond the transceiver into connectors, fiber & networking infrastructure required to move 1.6T bandwidth across broader AI fabric

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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• @tenet_research neutral 22 eng

  Tenet Market Wake-Up Summary 📷📷 June.22.26 $SPX $META $ABBV $APGE $UBER $TSLA $BA $SPCX $NFLX $MP $USAR $RCAT $LHX $LMT $RTX $GOOGL $KO $ASML $MSFT $CVX $HOOD $NOK $GETY $FRVO $POWW $VC $BWIN $SMCI $CRDO $EL $ACN $CLF $TEL $AAPL $DFTX $MPLT $MNTS $LGND @ripster47 | @TENETTRADEGROUP | @TenetCharts

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