$TER 0.51 Developing

Notable posts

• @amitisinvesting neutral 4401 eng

  NEW COMPANIES JUST ANNOUNCED TO JOIN THE NASDAQ 100 $QQQ: $NBIS $RKLB $CRWV $TER $ALAB

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• @StockSavvyShay neutral 1743 eng

  10 WAYS TO PLAY ROBOTICS IN 2026 1. $TER tests AI chips & owns the cobots through Universal Robots 2. $NOVT precision photonics & motion inside surgical & industrial robots 3. $OUST eyes & perception for physical AI machines that need to see & map physical world 4. $HIMX provides vision & display chips that help robots process images, depth & sensor inputs at edge 5. $AMBQ low power edge AI layer for robots & devices that need intelligence without burning massive amounts of energy 6. $ON becomes physical AI edge stack after acquiring $SYNA combining power, sensing, connectivity & edge AI for robotics 7. $SYM warehouse automation pure play using robotics & software to redesign how goods move through fulfillment centers 8. $VPG sits in force sensing & precision measurement layer that helps robots understand pressure, weight & real world movement 9. $TSLA humanoid platform bet with Optimus combining custom hardware, AI inference, autonomy software & real world manufacturing scale 10. $CCXI gives public market exposure to Agility Robotics which is one of clearest pure play humanoid robotics companies through its Digit warehouse robot

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• @StockSavvyShay bullish 958 eng

  $NVDA AI dominance is creating a massive opportunity well beyond Nvidia itself as billions flow through foundry, HBM, testing, packaging and server assembly Here’s who has the most exposure to Nvidia today: • $TSM 37% • $SKHY 27% • $MU 14% • $TER 8% • $ASX 3% • $FN 1% • $AMKR 1% • $CSCO 1% I also think the wild part is that Nvidia now spends more on HBM than on the wafers themselves and roughly a quarter of its revenue equivalent on test equipment which says a lot about how important memory, yield and validation have become at these die sizes.

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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• @StockSavvyShay bullish 734 eng

  $NVDA VERA RUBIN SUPPLY CHAIN Rubin is becoming a system-level buildout with rising content across memory, packaging, networking, power and cooling pushing the opportunity well beyond the GPU: • Memory sits with $MU, $SKHY & Samsung supplying the DRAM & HBM feeding Rubin accelerators while $SNDK adds exposure to storage layer around AI systems • Advanced packaging runs through $TSM, $AMKR & $INTC for foundry, packaging & assembly while $AMAT, $LRCX, $KLAC, $ASML, $TER & $AEHR provide equipment & testing needed to manufacture complex AI chips • Optical networking spans $COHR, $LITE & $AAOI in optical modules, $AVGO & $MRVL in switching silicon, $CRDO & $ALAB in high-speed connectivity & $GLW, $CIEN, $NOK & $ANET across fiber & network infrastructure • 800VDC power reaches from power semiconductors with $STM, $ON, $NVTS, $POWI & $WOLF into power management with $MPWR, $ADI, $TXN & $VICR • Power infrastructure & cooling sit downstream with $VRT, $ETN & $GEV supplying electrical distribution, backup power & thermal systems needed as rack densities keep rising • Compute systems bring full rack together through $DELL, $HPE & $SMCI which integrate Nvidia compute, networking, memory & power into deployable AI systems

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• @StockSavvyShay bullish 726 eng

  Goldman Sachs just more than tripled its 2035 humanoid TAM to $138B while raising its unit forecast to 6.5M with warehouses and logistics expected to lead adoption. That growth should pull demand through entire robotics stack: • Foundry: $TSM, $GFS • Sensing: $VPG, $NOVT • Vision: $OUST, $AEVA, $INVZ • Memory: $MU, $SKHY, $SNDK • Humanoids: $TSLA, $XPEV, $CCXI • AI Compute: $NVDA, $AMD, $ARM, $QCOM, $INTC • Simulation & Training: $NVDA, $ADSK, $CDNS, $SNPS • Semi Equipment: $ASML, $AMAT, $LRCX, $KLAC, $TER • Power & Control: $NXPI, $STM, $ADI, $TXN, $ON, $MCHP, $MPWR

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• @StockSavvyShay neutral 664 eng

  NEXT WEEKS EARNINGS ARE MASSIVE • Monday | $APLD, $NVTS, $CDNS, $AMKR • Tuesday | $BE, $KLAC, $PYPL, $V, $TER, $ENPH • Wednesday | $MSFT, $META, $HOOD, $ARM, $QCOM, $SOFI, $VRT, $LMND, $LRCX, $VKTX, $FTNT, $CVNA • Thursday | $AAPL, $AMZN, $COIN, $RBLX, $RDDT, $TEM, $RIVN, $FSLR, $MA, $PGY, $MSTR, $AXTI, $NXT • FRIDAY | $CVX, $XOM, $ABBV, $CCJ, $MRNA

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• @cevikfinance bullish 501 eng

  Böyle sert düşen günler sağlam şirketlere uzun vadeli eklemeler yapmak için harika fırsatlar. İşte bu sağlam şirketlere bazı örnekler: $MU $AMD $TSM $GEV $CRDO $ALAB $MRVL $ASML $AVGO $CEG $VST $ANET $VRT $TER $FIX $PWR $CLS $LLY $PLTR $NBIS $SOFI $HOOD $APP $COHR $RKLB $GLW $LRCX $BE $DELL Yatırım tavsiyesi değildir, her zaman kendi araştırmanızı yapınız!

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