$TXN 0.62 Developing

Notable posts

• @amitisinvesting bullish 1779 eng

  Did a stock draft with some friends and these are the 12 picks I have to hold until June 2027… 1. $NVDA 2. $AMD 3. $GEV 4. $TXN 5. $RKLB 6. $RDDT 7. $GOOGL 8. $FIX 9. $AAPL 10. $GLXY 11. $SNDK 12. $BE Am I cooked?

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• @StockSavvyShay neutral 793 eng

  THE 5 LAYERS OF AI POWER DELIVERY 1. Facility Power Intake • $CAT supplies backup generation • $GEV supplies grid equipment & gas turbines • $ETN provides switchgear, ATS & electrical distribution • $HUBB supplies grid & power distribution components • $NVT provides enclosures & electrical protection systems • $BE supplies on-site fuel cell power that helps bypass grid constraints 2. AC-to-DC Conversion • $ON supplies silicon carbide power devices • $POWI provides high-voltage AC-to-DC conversion ICs • $TXN provides power supply controllers & conversion ICs 3. Intermediate Bus Conversion • $VICR provides high-density intermediate bus modules 4. Point-of-Load • $AOSL supplies integrated power stages • $MPWR supplies point-of-load power for Nvidia systems • $ADI provides multiphase controllers & power management • $STM supplies SiC, GaN & power-management components for next-generation AI power delivery 5. The 800V DC Transition • $NVTS is working with $NVDA on its 800V HVDC roadmap • $VRT captures the transition through rack power, UPS & cooling infrastructure

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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• @TrendSpider neutral 103 eng

  Scanning for leading stocks (outperforming at least 85% of the $SPY) near the 50SMA... ⬇️👀 Texas Instruments $TXN Seagate $STX Western Digital $WDC GE Vernova $GEV Corning $GLW Warner Bros Discovery $WBD Nucor $NUE Franklin Resources $BEN Cummins $CMI FedEx $FDX Caterpillar $CAT Viatris $VTRS Cisco $CSCO

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• @TENETTRADEGROUP neutral 32 eng

  🚨 Get Ready for Another Big Week of Trading with our Weekly Calendar of Market Moving Events -> AMD Advancing AI Event - $AMD -> Major Earnings: $GOOGL $IBM $TSLA $TXN $SAP $INTC $LMT & many more -> New Home Sales, Flash PMI & Jobless Claims Ready for Opportunities at @TENETTRADEGROUP

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• @tenet_research neutral 23 eng

  Tenet Market Wake-Up Summary 📷📷 July.23.26 $SPX $USAR $AMZN $LMT $NOC $RXT $PLTR $ONDS $AVAV $BA $RCAT $KTOS $TSLA $MU $IBM $INTC $SKHY $LLY $GOOGL $SPCX $UBER $XE $F $NOW $FULT $MOH $TXN $CSX $LUV $LBRT $NOK $PKG $STM $RTX $CMCSA $PCG $TMUS $T $PAYP $VRSK $DUK $ROL $AGL $ZION $DOMO $NVEC $MEDP $BTC @ripster47 | @TENETTRADEGROUP | @TenetCharts

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