$VRT 0.61 Developing

Notable posts

• @StockSavvyShay neutral 3410 eng

  UPDATED FIB LEVELS FOR POPULAR STOCKS AI Utilities • $IREN $51 • $NBIS $177 • $CIFR $17 • $CRWV $100 AI Power • $EOSE $7 • $BE $237 • $NVTS $22 • $VRT $282 AI Hardware • $NVDA $192 • $TSM $408 • $ASML $1,618 • $MU $730 AI Applications • $PLTR $129 • $NOW $109 • $CRWD $598 • $SNOW $181 AI Connectivity • $AVGO $377 • $ALAB $305 • $CRDO $195 • $MRVL $236 Space • $RKLB $106 • $ASTS $89 • $PL $31 • $BKSY $32 Quantum • $IONQ $52 • $RGTI $15 • $QBTS $20 • $INFQ $13 Drones • $ONDS $10 • $AVAV $175 • $KTOS $52 • $UMAC $24 Nuclear • $OKLO $50 • $UUUU $12 • $GEV $906 • $LEU $151 Photonics • $AAOI $164 • $LITE $698 • $COHR $283 • $AEHR $76 CPU Bottleneck • $AMD $383 • $INTC $91 • $ARM $299 • $AMKR $57 Physical AI • $TSLA $382 • $AMZN $230 • $GOOGL $357 • $ISRG $394

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• @StockSavvyShay neutral 1430 eng

  UPDATED FIB LEVELS FOR POPULAR STOCKS AI Utilities • $IREN $31 • $NBIS $160 • $CIFR $17 • $CRWV $67 AI Power • $EOSE $3 • $BE $192 • $NVTS $8 • $VRT $245 AI Connectivity • $AVGO $368 • $ALAB $251 • $CRDO $183 • $MRVL $168 AI Hardware • $NVDA $190 • $TSM $377 • $ASML $1,713 • $MU $672 AI Applications • $PLTR $131 • $NOW $101 • $CRWD $196 • $SNOW $259 Physical AI • $TSLA $369 • $AMZN $245 • $GOOGL $335 • $VPG $84 Space • $RKLB $56 • $ASTS $47 • $PL $20 • $RDW $8 Quantum • $IONQ $26 • $RGTI $13 • $QBTS $16 • $INFQ $8 Drones • $ONDS $6 • $AVAV $99 • $KTOS $42 • $MRCY $92 Nuclear • $OKLO $33 • $UUUU $8 • $GEV $906 • $LEU $132 Photonics • $AAOI $87 • $LITE $636 • $COHR $311 • $AEHR $66 CPU Bottleneck • $AMD $467 • $INTC $88 • $ARM $242 • $AMKR $57

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• @StockSavvyShay neutral 1400 eng

  UPDATED FIB LEVELS FOR POPULAR STOCKS Space • $RKLB $92 • $ASTS $90 • $PL $32 • $RDW $12 Quantum • $IONQ $55 • $RGTI $19 • $QBTS $20 • $INFQ $13 Drones • $ONDS $9 • $AVAV $169 • $KTOS $52 • $MRCY $104 Nuclear • $OKLO $50 • $UUUU $15 • $GEV $906 • $LEU $182 Photonics • $AAOI $160 • $LITE $825 • $COHR $369 • $AEHR $110 CPU Bottleneck • $AMD $512 • $INTC $125 • $ARM $420 • $AMKR $83 Physical AI • $TSLA $382 • $AMZN $230 • $GOOGL $357 • $ISRG $397 AI Utilities • $IREN $56 • $NBIS $206 • $CIFR $17 • $CRWV $111 AI Power • $EOSE $7 • $BE $265 • $NVTS $24 • $VRT $282 AI Hardware • $NVDA $192 • $TSM $437 • $ASML $1,732 • $MU $1,013 AI Applications • $PLTR $121 • $NOW $95 • $CRWD $624 • $SNOW $181 AI Connectivity • $AVGO $368 • $ALAB $372 • $CRDO $262 • $MRVL $292

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• @StockSavvyShay neutral 1088 eng

  UPDATED FIB LEVELS FOR POPULAR STOCKS Space • $RKLB $92 • $ASTS $79 • $PL $26 • $RDW $8 Quantum • $IONQ $44 • $RGTI $16 • $QBTS $20 • $INFQ $10 Drones • $ONDS $7 • $AVAV $174 • $KTOS $52 • $MRCY $104 Nuclear • $OKLO $50 • $UUUU $12 • $GEV $906 • $LEU $132 Photonics • $AAOI $103 • $LITE $636 • $COHR $311 • $AEHR $59 CPU • $AMD $515 • $INTC $120 • $ARM $304 • $AMKR $64 Physical AI • $TSLA $382 • $AMZN $230 • $GOOGL $357 • $ISRG $397 AI Utilities • $IREN $31 • $NBIS $213 • $CIFR $17 • $CRWV $67 AI Power • $EOSE $4 • $BE $265 • $NVTS $13 • $VRT $282 AI Connectivity • $AVGO $334 • $ALAB $341 • $CRDO $210 • $MRVL $225 AI Hardware • $NVDA $192 • $TSM $419 • $ASML $1,732 • $MU $869 AI Applications • $PLTR $121 • $NOW $104 • $CRWD $171 • $SNOW $181

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• @StockSavvyShay neutral 890 eng

  THE ELECTRICITY VALUE CHAIN • $CCJ uranium supply • $CEG nuclear baseload • $SMR modular nuclear reactors • $OKLO micro-nuclear generation • $EOSE zinc long-duration storage • $GEV power conversion hardware • $VRT power distribution & cooling • $VST flexible generation & storage • $TSLA utility-scale lithium storage • $FSLR thin-film solar for hyperscale • $NNE utility-scale renewable buildout • $TLN North American renewable generation • $BWXT nuclear components & specialty fuel

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• @StockSavvyShay bullish 825 eng

  10 WAYS TO INVEST IN THE AI DATA CENTER BUILDOUT Data center demand is expected to nearly quadruple to 194 GW by 2035 as AI scales across more users, more tokens per user and more compute per token. Here are some of my favorite names positioned to benefit: 1. $TSM foundry manufacturing the accelerators, custom chips & networking silicon that nearly the entire AI buildout depends on. 2. $VRT liquid-cooling leader benefiting as rack density rises & AI systems require increasingly advanced thermal management. 3. $NVDA & $AMD accelerator duopoly at center of AI buildout with Nvidia's Vera Rubin entering full production & AMD’s Helios rack-scale systems emerging as a credible second source. 4. $MU & $SKHY memory engines of the AI era with HBM content scaling on every rack with data center margins above Nvidia's at segment level while suppliers themselves forecast shortage running into 2030. 5. $AVGO & $MRVL custom-silicon backbone, designing accelerators, networking chips & hyperscaler ASICs that capture more content across every AI rack. 6. $CRDO & $ALAB high-speed connectivity layer supplying the interconnect that lashes thousands of accelerators into one fabric 7. $OKLO & $SMR next-gen nuclear frontier with Oklo building the "local power plant" targeting microreactors beside data center campuses & NuScale developing larger modular reactors for utility-scale power. 8. $BE, $CEG & $VST provide power behind the AI buildout with Bloom delivering onsite fuel cells that bypass grid delays while Constellation & Vistra supply large-scale nuclear, gas & storage capacity to hyperscalers. 9. $LITE, $COHR & $AAOI optical layer benefiting from the transition from 800G to 1.6T with Lumentum & Coherent as components suppliers Nvidia took equity stakes in to secure next-generation optics capacity while AAOI is ramping U.S.-based 800G transceiver production for hyperscalers. 10. $ASML, $AMAT, $LRCX & $KLAC form equipment layer behind every new fab & packaging line with ASML’s EUV monopoly as ultimate chokepoint & Applied Materials, Lam & KLA supplying the deposition, etch & inspection tools required for every capacity expansion.

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• @StockSavvyShay neutral 793 eng

  THE 5 LAYERS OF AI POWER DELIVERY 1. Facility Power Intake • $CAT supplies backup generation • $GEV supplies grid equipment & gas turbines • $ETN provides switchgear, ATS & electrical distribution • $HUBB supplies grid & power distribution components • $NVT provides enclosures & electrical protection systems • $BE supplies on-site fuel cell power that helps bypass grid constraints 2. AC-to-DC Conversion • $ON supplies silicon carbide power devices • $POWI provides high-voltage AC-to-DC conversion ICs • $TXN provides power supply controllers & conversion ICs 3. Intermediate Bus Conversion • $VICR provides high-density intermediate bus modules 4. Point-of-Load • $AOSL supplies integrated power stages • $MPWR supplies point-of-load power for Nvidia systems • $ADI provides multiphase controllers & power management • $STM supplies SiC, GaN & power-management components for next-generation AI power delivery 5. The 800V DC Transition • $NVTS is working with $NVDA on its 800V HVDC roadmap • $VRT captures the transition through rack power, UPS & cooling infrastructure

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• @StockSavvyShay neutral 747 eng

  THE $NVDA VERA RUBIN SUPPLY CHAIN BREAKDOWN Nvidia’s Vera Rubin is ramping into full-scale production and reshaping the AI rack bill of materials in three major ways: more HBM per rack, a shift from pluggable to co-packaged optics and the move to 800VDC power. Here are the companies positioned to capture each transition: Memory Storage (content-per-rack story) • $MU, $SNDK, $SKHY and Samsung sit at the memory and storage layer as next-gen AI systems require more bandwidth, more capacity and faster data access. Advanced Packaging (bottleneck that gates everything) • Foundry / packaging: $TSM, $AMKR, $INTC • Packaging equipment: $AMAT, $LRCX, $KLAC, $ASML • Test / validation: $TER, $AEHR • Substrates / materials: $TTMI Optical Communication (CPO transition) • Optical modules: $COHR, $LITE, $AAOI • CPO / switching chips: $AVGO, $NVDA, $MRVL • High-speed connectivity: $CRDO, $ALAB • Fiber / networking: $GLW, $NOK, $CSCO, $ANET • Silicon photonics / packaging: $TSM, $GFS, $TSEM 800VDC Power Supply (architecture shift) • Wide-bandgap semis: $STM, $ON, $NVTS, $POWI, $WOLF • Power management / hardened devices: $MPWR, $ADI, $TXN, $AOSL, $VICR, $MCHP • Motherboard / connector / power module: $FLEX, $APH, $TEL • Infrastructure / power delivery: $VRT, $ETN, $GEV Compute System (integrators) • $DELL, $HPE, $SMCI provide the system-level integration layer that turns all of these components into deployable AI infrastructure.

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